CARBON METAL INTERFACES FOR ELECTRICAL CONNECTIONS, ELECTRONIC AND MICRO CIRCUIRY

CROSS-REFERENCE TO RELATED APPLICATIONS:

This application is a continuation-in-part of U.S. Patent Application number 18/678,915, filed May 30, 2024, currently pending, which is a continuation-in-part of U.S. Patent Application number 17/188,719, filed March 1, 2021, which is a continuation-in-part of U.S. Patent Application number 16/259,576, filed January 28, 2019, now U.S. Patent number 10,937,940, issued on March 2, 2021, which is a continuation-in-part of 16/154,594, filed October 8, 2018, which is a continuation of U.S. Patent Application number 15/608,674, filed May 30, 2017, now U.S. Patent number 10,096,761, issued on October 9, 2018.

Continuation of Patents:

• Patent 10,937,940 – Carbon metal interfaces for electrical connections, electronic and micro circuitry
• Patent 10,096,761 – Thermoelectric device assembly with fusion layer structure suitable for thermoelectric Seebeck and Peltier devices

Atty Docket No. APB1-PAU07 Abstract

There are two parts to build fusion carbon metal interconnects. First are the fusing metals/alloys, typically in the Martensite phase and lacking carbon. Second are carbonized materials that have carbon infused. These carbonized materials may be referred to as carbon donating materials. Both parts can be interchanged as the substrate or mounted component, or the parts can form linear interface connections. The finished interfaces have very low electrical resistance and/or zero interface electrical resistance.

The interconnect circuit topography materials and connections are endless and is dependent on circuit design. One example of such interface is a solderless thermoelectric device capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. Another example is the use for bonding microcircuits using fusion and/or surface absorption of carbon.