United States Patent 10,937,940
Bellezza March 2, 2021
Carbon metal interfaces for electrical connections, electronic and micro circuitry
Abstract
There are two parts to build fusion carbon metal interconnects. First are the fusing metals/alloys, typically in the Martensite phase and lacking carbon. Second are carbonized materials that have carbon infused. These carbonized materials may be referred to as carbon donating materials. Both parts can be interchanged as the substrate or mounted component, or the parts can form linear interface connections. The finished interfaces have very low electrical resistance and/or zero interface electrical resistance. The interconnect circuit topography materials and connections are endless and is dependent on circuit design. One example of such interface is a solderless thermoelectric device capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. The thermoelectric device forms a fusion layer between a copper metal layer and a semiconductor wafer layer to create a true metallurgical bond.
Inventors: Bellezza; Anthony Paul (Parkesburg, PA)
Applicant Name: Bellezza; Anthony Paul
Family ID: 74683121
Appl. No.: 16/259,576
Filed: January 28, 2019
Related U.S. Patent Documents
16154594 Oct 8, 2018
15608674 Oct 9, 2018 10096761
Current U.S. Class: 1/1
Current CPC Class: H01L 35/32 (20130101); H01L 35/34 (20130101); B23K 35/22 (20130101); H01L 35/325 (20130101); H01L 35/16 (20130101); H01L 35/08 (20130101)
Current International Class: H01L 35/32 (20060101); H01L 35/08 (20060101); H01L 35/16 (20060101); H01L 35/34 (20060101)
References Cited [Referenced By]
10096761 October 2018 Bellezza
2015/0118411 April 2015 Cardenas
2015/0293065 October 2015 Kissell
2016/0064638 March 2016 Salvador
2017/0108752 April 2017 Milliron
Primary Examiner: Nikmanesh; Seahvosh
Attorney, Agent or Firm: Patent Service Associates Smith; Lyman
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 16/154,594, filed Oct. 8, 2018, currently pending, which is a continuation of U.S. patent application Ser. No. 15/608,674, filed May 30, 2017, now U.S. Pat. No. 10,096,761, issued on Oct. 9, 2018.
Claims
What is claimed is:
1. A method for forming an interface, comprising: providing a carbon absorbing material operable to receive carbon from a carbon donating material; contacting the carbon donating material with the carbon absorbing material; applying a pressure to an assembly of the carbon absorbing material and the carbon donating material; and heating the assembly to a temperature below a melting point of each of the carbon absorbing material and the carbon donating material to cause a fusion bond to form from carbonization of the carbon absorbing material.
2. The method of claim 1, wherein the carbon absorbing material is a metal or a metal alloy in the Austenitic phase.
3. The method of claim 2 wherein the carbon absorbing material contacts the carbon donating material while in the Martensitic phase, wherein the heating step converts the carbon absorbing material from the Martensitic phase to the Austenitic phase.
4. The method of claim 3, wherein the carbon absorbing material forms the fusion bond while undergoing the Martensitic phase to the Austenitic phase change.
5. The method of claim 1, wherein the heating step is performed in an inert atmosphere.
6. The method of claim 1, wherein the carbon accepting materials are selected from the group consisting of a copper substrate, an iron substrate, and an iron/nickel substrate.
7. The method of claim 1, further comprising cooling the carbon absorbing material to change the carbon absorbing material to the Martensitic phase.
8. The method of claim 1, wherein the carbon donating material is selected from the group consisting of carbon, carbon nano-ribbon, graphene, carbon nano-tubes, and carbon impregnated metals, ceramics, polymers, sintered metal, powdered metals, alloys, and composites.
9. A method for making a carbon metal interconnect comprising: contacting a carbon donating material with a carbon absorbing material under at least one of temperature and pressure to create a fusion bond therebetween to form the carbon metal interconnect.
10. The method of claim 9, wherein the carbon absorbing material is a metal or metal alloy that can phase change from Martensite to Austenite while being heated.
11. The method of claim 9, wherein the carbon donating material is a carbon or carbonized member.
12. The method of claim 9, wherein the fusion bond forms while the carbon absorbing material undergoes a phase change from a Martensitic phase to an Austenitic phase.
13. The method of claim 9, wherein the carbon donating material is a semiconductor impregnated with graphene.
14. The method of claim 13, wherein the semiconductor impregnated with graphene has a breakage strength greater than the semiconductor alone.